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The subsidy policy of the United States aims to enhance its competitiveness in the field of chip manufacturing. By vigorously supporting advanced packaging technology, it has attracted the participation and investment of many companies. Companies such as Amkor have stepped up their R&D and production efforts to obtain the dividends brought by the policy.

However, this policy is not limited to the United States. The global semiconductor industry has changed as a result. Chip companies in other countries and regions are facing greater competitive pressure and have to speed up the pace of technological innovation and industrial upgrading.

At the same time, this policy has also had an impact on the upstream and downstream of the relevant industrial chain. Raw material suppliers, equipment manufacturers and terminal application manufacturers all need to adjust their strategies to adapt to the new market situation.

In this context, the logistics and transportation industry has also been affected to a certain extent. Although on the surface, air express seems to have no direct connection with this, in fact, changes in the semiconductor industry have indirectly affected logistics demand and transportation patterns.

With the development of the semiconductor industry, the requirements for the timeliness and safety of chip transportation are becoming higher and higher. Air express has become one of the important ways to transport chips due to its fast and efficient characteristics. However, the adjustment of the semiconductor industry structure caused by the US chip subsidy policy has changed the production and sales distribution of chips, thus affecting the transportation routes and transportation volume of air express.

For example, chip production bases that were originally concentrated in a certain area may be dispersed to other areas due to policy guidance. This requires air express companies to re-plan their transportation networks and optimize transportation plans to reduce costs and improve efficiency.

In addition, technological innovation in the semiconductor industry has also put forward new requirements for air express delivery. Advanced packaging technology makes chips smaller and more powerful, but also more fragile, requiring more sophisticated protection measures during transportation. Air express delivery companies need to continuously improve packaging technology and transportation equipment to ensure the safe transportation of chips.

In short, the intensive US chip subsidies for advanced packaging may seem to be just a policy adjustment within the semiconductor industry, but it actually has a profound impact on many related industries, including air express. We need to pay close attention to these changes to better adapt to the evolving global economic situation.