한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

the domestic duv lithography machine with a resolution of 65nm represents the progress and development of domestic lithography technology, but its capabilities are limited and can only support the manufacturing needs of mature process chips of 55-65nm. its factory standard overlay accuracy is relatively low, and the error in actual operation will increase, which is also related to the limitation of the overlay control window of a single exposure.

in recent years, international leading lithography technology giants such as asml have continuously innovated and achieved significant process breakthroughs with advanced technologies and equipment, such as asml nxt: 1970 and asml nxt: 1980. these machines provide guarantee for the mass production of 28nm process and even lead the progress of wafer manufacturing industry.

the limitations of single-shot exposure technology make multiple exposures critical, especially at overlay accuracies of 5.5nm and 2.75nm. multiple exposure technology can achieve lower precision requirements, thus opening up a new path for process breakthroughs.

however, domestic lithography machine manufacturers are facing huge challenges. the transition from dry duv lithography machines to immersion duv lithography machines requires overcoming technical difficulties. around the 2010s, asml took the lead in the field of lithography technology by virtue of the advantages of immersion duv lithography machines, and completely overturned the lithography market landscape at that time.

therefore, domestic lithography machine manufacturers need to constantly explore new technical routes and innovation paths, and strive to improve the level and accuracy of lithography technology in order to stand out in the highly competitive chip manufacturing market.